High-power LEDs require thermal management, which greatly increases the cost of LEDs. In the design process, the expensive addition is the heat sink. The heat sink can be made of a variety of metal materials. These materials include both relatively inexpensive aluminum and more conductive but more expensive materials (such as copper and silver). These expensive materials may cause the cost of high-power products to increase by 1 to 10 dollars, and standard LED devices can avoid this cost increase.

    Similarly, high-power LEDs also need to use MCPCB as another passive cooling technology to control the junction temperature. Because the material of MCPCB has better thermal conductivity, compared to the cheaper FR4 PCB used in standard LEDs, these circuit boards have higher heat dissipation efficiency. However, its cost may be as high as 5 times the cost of FR4 PCB. Using a cheaper FR4 PCB, eliminating the need for expensive heat sinks, and simplifying design considerations, can save up to 60% of the cost.

The single high-power LED has high luminous efficiency, small unit size, great design flexibility, can fit the structural characteristics of the light carrier to the greatest extent, and is easy to install. Provides a brand-new lighting solution for this type of building.

    High-power LEDs have shown obvious advantages in energy saving and long life in replacing incandescent light sources. Since incandescent lamps and other traditional light sources have little room for improvement in many technologies, LED lamps replace or replace existing washers. The luminous efficiency of high-power wall washer is much higher than that of traditional wall washer. However, due to the high initial purchase cost, compared with traditional wall washer, its energy-saving effect is not very obvious.

    Eutectic soldering technology is one of the key technologies in the high-power LED flip-chip packaging process. The advantages of eutectic soldering technology, which is the core heat dissipation problem and die bonding problem in the LED packaging process, are and will become the mainstream direction of future LED packaging development. Eutectic alloys have a lower melting point than pure components, and the melting process is simple; eutectic alloys have better fluidity than pure metals, and can prevent the formation of dendrites that hinder liquid flow during solidification, thereby improving casting performance; eutectic alloys It also has the characteristics of constant temperature transformation (no solidification temperature range), which can reduce casting defects, such as segregation and shrinkage; the solidified eutectic alloy has strong toughness (close to the toughness of the metal) and is not suitable for fracture; eutectic solidification can obtain a variety of forms The microstructure, especially the regularly arranged layered or rod-shaped eutectic structure, can become an in-situ composite material with excellent performance. It is precisely because eutectic has so many advantages, so LED packages made using eutectic technology will have the advantages of lowering impedance and improving heat conduction efficiency.