First, strictly control the quality of packaging materials for LED high bay lights, such as conductive glue, silica gel, phosphor, epoxy resin, die attach materials, bases, etc. Secondly, rationally design the packaging structure of LED high bay lights. For example, unreasonable packaging will cause pressure and lead to breakage. Then, improve the process technology of LED high bay light, such as curing temperature, pressure welding, sealing glue, loading and time, etc. must be carried out in strict accordance with the requirements.

To increase the life of LED high bay lamp driving power supply, it is necessary to choose high-quality, long-life capacitors to improve the life of the driving power supply; reduce the ripple current and working voltage flowing through the capacitor; improve the efficiency of the power supply drive and reduce the thermal resistance of the components ; Take protective measures such as waterproof treatment, and pay attention to the choice of thermal conductive glue.

The quality of heat dissipation design is a key factor in the life of LED industrial and mining lamps. If chips of the same quality are put into lamps of different designs, the life span varies greatly, and can even reach dozens of times. Therefore, the success of a lamp design depends on its heat dissipation system.

LED heat dissipation usually includes system-level heat dissipation and package-level heat dissipation. In order to reduce the thermal resistance of the lamp, these two types of heat dissipation must be considered at the same time. Package-level heat dissipation is the design of packaging materials, packaging structure and process level in the production process of LED light sources. In order to achieve the purpose of heat dissipation. In terms of package heat dissipation design, currently there are mainly silicon-based flip chip structures, metal circuit board structures for heat dissipation, chip bonding materials, epoxy resin and other materials for heat dissipation. System-level heat dissipation is mainly through the research of related technologies to innovate and improve the radiator. With the popularity of high-power LEDs, power is increasing. At present, system-level heat dissipation mainly includes thermoelectric cooling and heat pipe cooling. And adopts air-cooled forced heat dissipation method structure. Solving the heat dissipation problem is an effective way to improve the life of LED high bay lights, so further research and innovation are needed.